ele layer (SusTech GmbH)
Structured Review

Ele Layer, supplied by SusTech GmbH, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
https://www.bioz.com/product/ele+layer/ele+layer/pmc09399151-70-5-8
Average 90 stars, based on 1 article reviews
Images
1) Product Images from "Integrated 3D printing of flexible electroluminescent devices and soft robots"
Article Title: Integrated 3D printing of flexible electroluminescent devices and soft robots
Journal: Nature Communications
doi: 10.1038/s41467-022-32126-1
Figure Legend Snippet: a Schematic illustration showing the multi-material direct ink writing of flexible EL devices. The electroluminescent devices consist of an electroluminescent elastomer (ELE) layer and an insulating dielectric elastomer (IDE) layer sandwiched between two ion conducting elastomer (ICE) layers. The robust interface is built through the covalent bonds. b Schematic illustration of the electroluminescent soft robot (ELbot) featuring chameleon-like adaptiveness to external light variation.
Techniques Used:
Figure Legend Snippet: a Schematic illustration of the multi-material printing process for fabricating an EL device, which consisted of two ion conducting elastomer (ICE) layers and one electroluminescent elastomer (ELE) layer. The addition of SiO 2 nanoparticles in the inks leads to physically-crosslinked gels, which are fluidized by the shearing force during ink extrusion and can be recovered to the gel state right after printing. Further UV-initiated polymerization of DMAPS/PEGDA or TEAc/PEGDA leads to the formation of an intact network structure. b Images of the 3DP EL devices under mechanical deformation (i.e., twisting and bending), which are powered with an alternating current. Scale bar: 5 mm. c Shear storage moduli ( G ') and loss moduli ( G '') of the ICE, ELE, and IDE inks as a function of shear stress at 25 ∘ C, measured under an oscillatory mode at a frequency of 1 Hz. d Apparent viscosity of the optimized ICE, ELE, and IDE inks as a function of shear rate at 25 ∘ C. e Images of the high-fidelity electroluminescent prints of the ELE patterns. f Summary of the physical parameters (i.e., modulus ( E ), strength ( S ), elongation at break ( λ ) and conductivity ( σ )) of the ICE samples fabricated from both molding and the 3D printing techniques. g Plotting of the luminance intensity of the 3DP ELE patterns using inks with or without SiO 2 NPs against the applied voltage per thickness ( E ) (thickness of ELE layer was 150 μm, frequency of the applied voltage was 500 Hz). h Plotting of the luminance intensity of the 3DP ELE patterns against the applied voltage per thickness ( E ) at various frequencies of the applied voltage. Data in f , g , and h are means ± S.D., n = 3 independent samples.
Techniques Used: Shear, Viscosity
Figure Legend Snippet: a Schematic illustration of the multi-material DIW process for fabricating EL devices. ICE, IDE and ELE Inks were printed sequentially. b – d SEM images of the multi-layer structure of the 3DP samples ( b ), the interface between the ICE and ELE layers ( c ), and the interface between two ICE layers ( d ) of the 3DP samples. Scale bar: 200 μm ( b ) and 50 μm ( c , d ). e Simulated displacement distributions within the 3DP EL device (top) and a physically-laminated sample (bottom) at an overall applied strain of 35%. Both devices consisted of a ELE layer (with “SUSTech” logo) and an ICE layer. The simulation was performed via finite element analysis. Mechanically compliant and robust interface was evidenced in the 3DP EL device, while weak interface and interfacial delamination were detected for the physically-laminated EL device. f The designated CAD models and the images of the 3DP EL devices with multi-color electroluminescent components with alternative voltage on or off. Scale bar: 5 mm. g Images of a 3DP flexible EL wristband, indicating the stable electroluminescent features under mechanical deformation, such as bending and twisting. Scale bar: 1 cm.
Techniques Used:
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